The FIR150N06G uses advanced trench technology and design to provide excellent RDS(ON) with low gate charge. It can be used in a wide variety of applications. General Features ƽ VDS =60V,ID =150A RDS(ON) <4.5mΩ @ VGS=10V ƽ High density cell design for ultra low Rdson ƽ Fully characterized Avalanche voltage and current ƽ Good stability and uniformity with hig.
ƽ VDS =60V,ID =150A RDS(ON) <4.5mΩ @ VGS=10V ƽ High density cell design for ultra low Rdson ƽ Fully characterized Avalanche voltage and current ƽ Good stability and uniformity with high EAS ƽ Excellent package for good heat dissipation ƽ Special process technology for high ESD capability Application ƽ Power switching application ƽ Hard Switched and High Frequency Circuits ƽ Uninterruptible Power Supply FIR150N06PG PIN Connection TO-220AB GDS Marking Diagram YAWW FIR150N06P Y = Year A = Assembly Location WW = Work Week FIR150N06P = Specific Device Code Package Marking And Ordering Informat.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | FIR20N120TDG |
American First Semiconductor |
IGBT | |
2 | FIR2N60FG |
First Semiconductor |
Advanced N-Ch Power MOSFET | |
3 | FIR3441AG |
First Semiconductor |
P-Channel Enhancement Mode Power MOSFET | |
4 | FIR4N65F |
INCHANGE |
N-Channel MOSFET | |
5 | FIR80N075P |
First Semiconductor |
N-Channel Power MOSFET | |
6 | FIR80N075PG |
First Semiconductor |
N-Channel Power MOSFET | |
7 | FIR8N60FG |
First Semiconductor |
Silicon N-Channel Power MOSFET | |
8 | FIRC5730W09-B20 |
CT Micro |
SMD Type 730nm Infrared Emitter | |
9 | FIRP1608X09-H5 |
CT Micro |
Infrared Emitter | |
10 | FI-5530C |
Fujitsu |
Image Scanner Manual | |
11 | FI-5530C2 |
Fujitsu |
Image Scanner Manual | |
12 | FI-A20C |
Japan Aviation Electronics |
Connector |