Top View This device is produced with high cell density DMOS trench technology, which is especially used to minimize on-state resistance. This device particularly suits low voltage applications such as portable equipment, power management and other battery powered circuits, and low in-line power dissipation are needed in a very small outline surface .
VDS VGS
RDSon TYP 38mR@-4V5
ID ESD
Applications
Load Switch
Portable Devices
DCDC conversion
-20V ±8V
47mR@-2V5 61mR@-1V8
-6A 3KV
Pin Configuration
General Description
Top View
This device is produced with high cell density DMOS
trench technology, which is especially used to minimize
on-state resistance. This device particularly suits low
voltage applications such as portable equipment, power
management and other battery powered circuits, and
low in-line power dissipation are needed in a very small
outline surface mount package. Excellent thermal and
D: Drain; G: .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SSC8322GN2 |
AFSEMI |
Dual N-Channel Enhancement Mode MOSFET | |
2 | SSC8323GN2 |
AFSEMI |
Dual P-Channel Enhancement Mode MOSFET | |
3 | SSC8323GN3 |
AFSEMI |
Dual P-Channel Enhancement Mode MOSFET | |
4 | SSC8326GS1V1.0 |
AFSEMI |
Dual N-Channel Enhancement Mode MOSFET | |
5 | SSC8329GS1 |
AFSEMI |
Dual P-Channel Enhancement Mode MOSFET | |
6 | SSC8313GS1 |
AFSEMI |
Dual P-Channel Enhancement Mode MOSFET | |
7 | SSC8330GQ4 |
AFSEMI |
Dual N-Channel Enhancement Mode MOSFET | |
8 | SSC8333GS1 |
AFSEMI |
Dual P-Channel Enhancement Mode MOSFET | |
9 | SSC8336GS1 |
AFSEMI |
Dual N-Channel Enhancement Mode MOSFET | |
10 | SSC8339GS1 |
AFSEMI |
Dual P-Channel Enhancement Mode MOSFET | |
11 | SSC8362GS1 |
AFSEMI |
Dual N-Channel Enhancement Mode MOSFET | |
12 | SSC8013GS6 |
AFSEMI |
P-Channel Enhancement Mode MOSFET |