eGaN® FET DATASHEET EPC2212 - Automotive 100 V (D-S) Enhancement Mode Power Transistor VDS , 100 V RDS(on) , 13.5 mΩ ID , 18 A AEC-Q101 D G S EPC2212 EFFICIENT POWER CONVERSION HAL Gallium Nitride’s exceptionally high electron mobility and low temperature coefficient allows very low RDS(on), while its lateral device structure and majority carrier diode.
rd
4
°C/W
RθJA Thermal Resistance, Junction-to-Ambient (Note 1)
69
Note 1: RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board. See https://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf for details.
EPC2212 eGaN® FETs are supplied only in passivated die form with solder bars. Die size: 2.1 x 1.6 mm
Applications
• Lidar/Pulsed Power Applications
• High Power Density DC-DC Converters
• Class-D Audio
• High Intensity Headlamps
Benefits
• Ultra High Efficiency
• Ultra Low RDS(on)
• Ultra L.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | EPC2214 |
EPC |
Power Transistor | |
2 | EPC2215 |
EPC |
Power Transistor | |
3 | EPC2202 |
EPC |
Power Transistor | |
4 | EPC2203 |
EPC |
Power Transistor | |
5 | EPC2204 |
EPC |
Power Transistor | |
6 | EPC2206 |
EPC |
Power Transistor | |
7 | EPC2207 |
EPC |
Power Transistor | |
8 | EPC2 |
Altera Corporation |
Configuration Devices | |
9 | EPC20 |
ACME |
EPC Cores | |
10 | EPC2001 |
EPC |
Power Transistor | |
11 | EPC2001C |
EPC |
Power Transistor | |
12 | EPC2007 |
EPC |
Power Transistor |