w w at .D w h FET Power Amplifier Module for Mobile Phone MOS S a ADE-208-461 (Z) 1st Edition July 1, 1996 ee U 4 t m o .c PF0031 Application PF0031: For NMT900 890 to 925 MHz Features • High stability: Load VSWR ≈ 20:1 • Low power control current: 400 µA • Thin package: 5 mm t Pin Arrangement • RF-B2 w w .D w 5 t a 1 S a 2 e h 3 t e 5 4 U 4.
• High stability: Load VSWR ≈ 20:1
• Low power control current: 400 µA
• Thin package: 5 mm t
Pin Arrangement
• RF-B2
w
w
.D w
5
t a
1
S a
2
e h
3
t e
5 4
U 4
.c
m o
1: Pin 2: VAPC 3: VDD 4: Pout 5: GND
w
w
w
.D
a
S a t
e e h
U 4 t
m o .c
PF0031
Internal Diagram and External Circuit
G GND Pin1 Pin Pin2 VAPC Pin3 VDD Pin4 Pout
G GND
Z1
C1
FB1
C3
FB2
C2
Z2
Pin
VAPC
VDD
Pout
C1 = C2 = 0.01 µF (Ceramic chip capacitor) C3 = 10 µF (Aluminum Electrolyte Capacitor) FB = Ferrite bead BL01RN1-A62-001 (Manufacture: MURATA) or equivalent Z1 = Z2 = 50 Ω (Microstrip line).
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | PF0030 |
Hitachi Semiconductor |
MOS FET Power Amplifier | |
2 | PF0032 |
Hitachi Semiconductor |
MOS FET Power Amplifier | |
3 | PF0010 |
Renesas Technology |
High Frequency Power MOS FET Module | |
4 | PF00105A |
Hitachi Semiconductor |
MOS FET Power Amplifier Module for AMPS Handy Phone | |
5 | PF0027 |
Renesas Technology |
MOS FET Power Amplifier Module | |
6 | PF0100 |
NXP |
14-channel configurable power management | |
7 | PF0100Z |
NXP |
14-channel configurable power management | |
8 | PF0121 |
Hitachi Semiconductor |
MOS FET Power Amplifier Module for GSM Mobile Phone | |
9 | PF01410A |
Hitachi Semiconductor |
MOS FET Power Amplifier Module for GSM Handy Phone | |
10 | PF01411A |
Hitachi Semiconductor |
MOS FET Power Amplifier Module for E-GSM Handy Phone | |
11 | PF01411B |
Hitachi Semiconductor |
MOS FET Power Amplifier Module for E-GSM Handy Phone | |
12 | PF01412A |
Hitachi Semiconductor |
MOS FET Power Amplifier Module for E-GSM Handy Phone |