This series of POWER MOSFETS represents the most advanced high voltage technology. The optmized cell layout coupled with a new proprietary edge termination concur to give the device low RDS(on) and gate charge, unequalled ruggedness and superior switching performance. APPLICATIONS s HIGH CURRENT, HIGH SPEED SWITCHING s SWITCH MODE POWER SUPPLIES (SMPS) s DC-.
GS = 0) Drain- gate Voltage (R GS = 20 k Ω) Gate-source Voltage Drain Current (continuous) at T c = 25 o C o Drain Current (continuous) at T c = 100 C Drain Current (pulsed) Total Dissipation at Tc = 25 o C Derating Factor Insulation W ithstand Voltage (DC) St orage Temperature Max. Operating Junction Temperature Valu e 600 600 ± 30 3.9 2.6 26 40 0.32 2000 -65 to 150 150 Unit V V V A A A W o W/ C V o C o C
(
•) Pulse width limited by safe operating area
October 1997
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STP6NA60FP
THERMAL DATA
R t hj-ca se R t hj- amb R thc- si nk Tl Thermal Resistance Junction-case Max.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | P6NA60FI |
ST Microelectronics |
STP6NA60FI | |
2 | P6NA60 |
STMicroelectronics |
STP6NA60 | |
3 | P6N25 |
ST Microelectronics |
STP6N25 | |
4 | P6N60 |
Fairchild Semiconductor |
FQP6N60 | |
5 | P6N60FI |
ST Microelectronics |
STP6N60FI | |
6 | P6N70 |
Fairchild Semiconductor |
FQP6N70 | |
7 | P6N70A |
Fairchild Semiconductor |
SSP6N70A | |
8 | P6N80 |
Fairchild Semiconductor |
FQP6N80 | |
9 | P6NB50FP |
STMicroelectronics |
STP6NB50FP | |
10 | P6NB80FP |
ST MICROELECTRONICS |
STP6NB80FP | |
11 | P6NC60 |
ST Microelectronics |
STP6NC60 | |
12 | P6NC60FP |
STMicroelectronics |
STP6NC60FP |