AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Strasse 53 D-81541 München © Infineon Technologies AG 2000 All Rights Reserved. Attention please! The information herein is given to.
A
• 1700V EMCON 3 technology 200 µm chip This chip is used for:
• soft, fast switching
• EUPEC power modules
• low reverse recovery charge
• small temperature coefficient
Applications:
C
• resonant applications, drives
Chip Type SIDC161D170H
VR
IF
Die Size
1700V 300A 12.7 x 12.7 mm2
Package Ordering Code
sawn on foil
Q67050-A4180A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization
Cathode metallization
Die bond Wire bond Reject Ink Dot Size
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