The MT5C1001 employs low power, high-performance silicon-gate CMOS technology. Static design eliminates the need for external clocks or timing strobes while CMOS circuitry reduces power consumption and provides for greater reliability. For flexibility in high-speed memory applications, Micross offers chip enable (CE) and output enable (OE) capability. These e.
• High Speed: 20, 25, 35, and 45
• Battery Backup: 2V data retention
• Low power standby
• Single +5V (+10%) Power Supply
• Easy memory expansion with CE and OE options.
• All inputs and outputs are TTL compatible
• Three-state output
OPTIONS
• Timing 20ns access 25ns access 35ns access 45ns access 55ns access 70ns access
MARKING
-20 -25 -35 -45 -55
* -70
*
• Package(s) Ceramic DIP (400 mil) Ceramic LCC Ceramic Flatpack Ceramic SOJ
C
No. 109
EC No. 207
F
No. 303
DCJ No. 501
• Operating Temperature Ranges
Industrial (-40oC to +85oC)
IT
Military (-55oC to +125oC)
XT
• 2V data retent.
The MT5C1001 employs low power, high-performance silicon-gate CMOS technology. Static design eliminates the need for ext.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | MT5C1005 |
ASI |
SRAM MEMORY ARRAY | |
2 | MT5C1005 |
Micross |
256K x 4 SRAM | |
3 | MT5C1005 |
Micron |
256K x 4 SRAM | |
4 | MT5C1008 |
ASI |
128K x 8 SRAM WITH DUAL CHIP ENABLE AVAILABLE AS MILITARY SPECIFICATIONS | |
5 | MT5C1008 |
Micron |
128K x 8 SRAM | |
6 | MT5C1008LL |
Austin Semiconductor |
128K x 8 SRAM WITH DUAL CHIP ENABLE ULTRA LOW POWER | |
7 | MT5C1009 |
Micross |
128K x 8 SRAM | |
8 | MT5C1189 |
Micron |
128K x 9 SRAM | |
9 | MT5C128K8A1 |
Micron Technology |
128K x 8 SRAM | |
10 | MT5C128K8A1S13A |
Micron Technology |
1M SRAM | |
11 | MT5C1601 |
Micron |
16K x 1 SRAM | |
12 | MT5C1604 |
Micron |
4K x 4 SRAM |