This device is an IGBT developed using an advanced proprietary trench gate and field stop structure. The device is part of the "V" series of IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of ver.
• Maximum junction temperature: TJ = 175 °C
• Very high speed switching series
• Tail-less switching off
• Low saturation voltage: VCE(sat) = 1.8 V (typ.)
@ IC = 20 A
• Tight parameters distribution
• Safe paralleling
• Low thermal resistance
• Very fast soft recovery antiparallel diode
• Lead free package
Applications
• Photovoltaic inverters
• Uninterruptible power supply
• Welding
• Power factor correction
• Very high frequency converters
Description
This device is an IGBT developed using an advanced proprietary trench gate and field stop structure. The device is part of the "V" series of.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | GB200 |
Digitron Semiconductors |
SILICON CONTROLLED RECTIFIERS | |
2 | GB200A |
Digitron Semiconductors |
SILICON CONTROLLED RECTIFIERS | |
3 | GB200TS60NPBF |
Vishay Siliconix |
Ultrafast Speed IGBT | |
4 | GB201 |
Digitron Semiconductors |
SILICON CONTROLLED RECTIFIERS | |
5 | GB201A |
Digitron Semiconductors |
SILICON CONTROLLED RECTIFIERS | |
6 | GB20B60PD1 |
International Rectifier |
IRGB20B60PD1 | |
7 | GB20NB32LZ |
ST Microelectronics |
N-CHANNEL PowerMESH TM IGBT | |
8 | GB20NB32LZ-1 |
ST Microelectronics |
N-CHANNEL PowerMESH TM IGBT | |
9 | GB20NC60V |
STMicroelectronics |
very fast IGBT | |
10 | GB20SLT12-247 |
GeneSiC |
Silicon Carbide Schottky Diode | |
11 | GB25MPS17-247 |
GeneSiC |
Silicon Carbide Schottky Diode | |
12 | GB25RF120K |
International Rectifier |
IGBT PIM MODULE |