FDZ204P - Fairchild Semiconductor

FDZ204P P-Channel 2.5V Specified PowerTrench

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, l.

Features

•
  –4.5 A,
  –20 V. RDS(ON) = 45 mΩ @ VGS =
  –4.5 V RDS(ON) = 75 mΩ @ VGS =
  –2.5 V
• Occupies only 4 mm2 of PCB area. Less than 40% of the area of a SSOT-6
• Ultra-thin package: less than 0.80 mm height when mounted to PCB
• Ultra-low Qg x RDS(ON) figure-of-merit.
• High power and current handling capability. General Description Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ204P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal t.