eGaN® FET DATASHEET EPC2024 – Enhancement Mode Power Transistor VDS , 40 V RDS(on) , 1.5 mΩ ID , 90 A D G S EPC2024 EFFICIENT POWER CONVERSION HAL Gallium Nitride’s exceptionally high electron mobility and low temperature coefficient allows very low RDS(on), while its lateral device structure and majority carrier diode provide exceptionally low QG and z.
05 mm x 2.3 mm
• High Speed DC-DC Conversion
• Motor Drive
• Industrial
Automation
• Synchronous
Rectification
• Inrush Protection
• Point-of-Load (POL)
Converters
Thermal Characteristics
PARAMETER
TYP
UNIT
RθJC Thermal Resistance, Junction-to-Case
0.4
RθJB Thermal Resistance, Junction-to-Board
1.1
°C/W
RθJA Thermal Resistance, Junction-to-Ambient (Note 1)
42
Note 1: RθJA is determined with the device mounted on one square inch of copper pad, single layer 2 oz copper on FR4 board. See https://epc-co.com/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf for.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | EPC2021 |
EPC |
Power Transistor | |
2 | EPC2022 |
EPC |
Power Transistor | |
3 | EPC2023 |
EPC |
Power Transistor | |
4 | EPC2029 |
EPC |
Power Transistor | |
5 | EPC20 |
ACME |
EPC Cores | |
6 | EPC2001 |
EPC |
Power Transistor | |
7 | EPC2001C |
EPC |
Power Transistor | |
8 | EPC2007 |
EPC |
Power Transistor | |
9 | EPC2010 |
EPC |
Power Transistor | |
10 | EPC2010C |
EPC |
Power Transistor | |
11 | EPC2012 |
EPC |
Power Transistor | |
12 | EPC2012C |
EPC |
Power Transistor |