No. | Partie # | Fabricant | Description | Fiche Technique |
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Silicon |
SSM70T03H |
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Silicon Standard |
SSM40N03P a Symbol Rthj-c Rthj-a Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. Value 2.5 62 Unit °C/W °C/W Rev.2.01 7/01/2004 www.SiliconStandard.com 1 of 6 SSM40N03P Electrical Characteristics @ Tj=25oC (unless o |
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Silicon Standard |
N-channel Enhancement-mode Power MOSFET S ID IDM PD EAS TSTG TJ Parameter Drain-source voltage Gate-source voltage Continuous drain current, TC = 25°C TC = 100°C Pulsed drain current 1 http://www.DataSheet4U.net/ Value 30 ±20 45 32 120 44 0.352 3 Units V V A A A W W/°C mJ °C °C Total po |
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Silicon Standard |
SSM70L02H |
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Toshiba Semiconductor |
Silicon N-Channel MOSFET tc.) are within the JEITA TOSHIBA ― 2-1L1B absolute maximum ratings. Please design the appropriate reliability upon reviewing the Weight: 1.5 mg (typ.) Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Meth |
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Silicon Standard |
Dual N-channel Enhancement-mode Power MOSFET |
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Toshiba Semiconductor |
Silicon N-Channel MOSFET are within the absolute maximum ratings. Weight: 6.0 mg (typ.) Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliabil |
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Silicon Standard |
N-Channel MOSFET ID IDM PD EAS TSTG TJ Parameter Drain-source voltage Gate-source voltage Continuous drain current, TC = 25°C TC = 100°C Pulsed drain current 1 Value 30 ±20 60 43 195 53 0.36 3 Units V V A A A W W/°C mJ °C °C Total power dissipation, TC = 25°C Lin |
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Toshiba Semiconductor |
Silicon Epitaxial Schottky Barrier Diode ting −55 to 125 −40 to 100 Unit °C °C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability signifi |
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Silicon Standard |
N-channel Enhancement-mode Power MOSFET |
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Silicon Standard |
N-channel Enhancement-mode Power MOSFET |
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Silicon Standard |
N-CHANNEL ENHANCEMENT MODE POWER MOSFET |
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Silicon Standard |
N-Channel Enhancement Mode Power MosFET |
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Toshiba Semiconductor |
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type als. 1 2003-03-27 SSM3K02F Electrical Characteristics (Ta = 25°C) Characteristics Gate leakage current Drain-source breakdown voltage Drain cut-off current Gate threshold voltage Forward transfer admittance Drain-source ON resistance Input capacit |
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Toshiba Semiconductor |
Silicon N-Channel MOSFET in the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test |
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Silicon Standard |
N-Channel Enhancement Mode Power MosFET |
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Silicon Standard |
N-Channel Enhancement Mode Power MOSFET |
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Silicon Standard |
P-Channel MOSFET °C °C °C Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range Thermal Data Symbol Rthj-a Parameter Thermal Resistance Junction-ambient 3 Value Max. 50 Unit °C/W 12/02/2004 Rev.2.01 www.Si |
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Silicon Standard |
N-Channel MOSFET perating Junction Temperature Range 450 -55 to 175 -55 to 175 THERMAL DATA Symbol Rthj-c Rthj-a Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. Value 0.5 62 Units ℃/W ℃/W 07/11/2007 Rev.1.00 www.SiliconSta |
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Toshiba Semiconductor |
Silicon P-Channel MOSFET reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/ “Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note1: Mounted on an FR |
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