AQL 0,65 for visual inspection according to failure catalog Electrostatic Discharge Sensitive Device according to MIL-STD 883 Test-Normen Villach/Prüffeld Published by Infineon Technologies AG Bereich Kommunikation St.-Martin-Strasse 53 D-81541 München © Infineon Technologies AG 2000 All Rights Reserved. Attention please! The information herein is given to.
• 1700V EMCON 3 technology 200 µm chip This chip is used for:
• soft, fast switching
• EUPEC power modules
A
• low reverse recovery charge
• small temperature coefficient
Applications:
• resonant applications, drives
C
Chip Type SIDC78D170H
VR
IF
Die Size
Package Ordering Code
1700V 150A
7.35 x 10.65 mm2
sawn on foil
Q67050-A4177A001
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Anode metallization
Cathode metallization
Die bond Wire bond Reject Ink Dot Size
Recomme.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | SIDC73D170E6 |
Infineon |
Fast switching diode | |
2 | SIDC02D60C8 |
Infineon |
Fast switching diode | |
3 | SIDC02D65C8 |
Infineon |
Fast switching diode | |
4 | SIDC03D120H8 |
Infineon |
Fast switching diode | |
5 | SIDC03D60C8 |
Infineon |
Fast switching diode | |
6 | SIDC03D65C8 |
Infineon |
Fast switching diode | |
7 | SIDC05D60C8 |
Infineon |
Fast switching diode | |
8 | SIDC05D60SIC3 |
Infineon Technologies AG |
Silicon Carbide Schottky Diode | |
9 | SIDC05D65C8 |
Infineon |
Fast switching diode | |
10 | SIDC06D120F6 |
Infineon |
Fast switching diode | |
11 | SIDC06D120H8 |
Infineon |
Fast switching diode | |
12 | SIDC06D60C8 |
Infineon |
Fast switching diode |