Third Generation HEXFETs from International Rectifier provide the designer with the best combination of fast switching, ruggedized device design, low onresistance and cost-effectiveness. The 4-pin DIP package is a low-cost machine-insertable case style which can be stacked in multiple combinations on standard 0.1 inch pin centers. The dual drain serves as a .
Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds Max. 0.45 0.29 3.6 1.0 0.0083 ±20 57 0.45 0.10 4.8 -55 to + 150 300 (1.6mm from case) Units A W W/°C V mJ A mJ V/ns °C Thermal Resistance RθJA Parameter Junction-to-Ambient Min. — Typ. — Max. Units 120 °C/W Revision 0 IRFD214 Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter V(BR)DSS Drain-to-Source Breakdown Voltage ∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient RDS(on) Static Drain-to-Source On-Res.
Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | IRFD210 |
Intersil Corporation |
N-Channel Power MOSFET | |
2 | IRFD210 |
International Rectifier |
Power MOSFET | |
3 | IRFD210 |
GE |
FIELD EFFECT POWER TRANSISTOR | |
4 | IRFD210PBF |
International Rectifier |
HEXFET Power MOSFET | |
5 | IRFD211 |
GE |
FIELD EFFECT POWER TRANSISTOR | |
6 | IRFD212 |
GE |
FIELD EFFECT POWER TRANSISTOR | |
7 | IRFD213 |
IOR |
N-Channel Transistor | |
8 | IRFD213 |
Motorola |
MOSFET | |
9 | IRFD213 |
Harris |
N-Channel Power MOSFET | |
10 | IRFD213 |
Siliconix |
N-Channel Transistor | |
11 | IRFD213 |
GE |
FIELD EFFECT POWER TRANSISTOR | |
12 | IRFD220 |
Intersil Corporation |
N-Channel Power MOSFET |