The device is manufactured using high voltage multi-epitaxial planar technology for high switching speeds and high voltage capability. It uses a hollow emitter structure to enhance switching speeds. 3 2 1 TO-220 Figure 1. Internal schematic diagram Table 1. Device summary Order code Marking (1) Package Packaging ST13009 13009 L 13009 H TO-220 Tube .
■ Low spread of dynamic parameters
■ High voltage capability
■ Minimum lot-to-lot spread for reliable operation
■ Very high switching speed
Applications
■ Switch mode power supplies
Description
The device is manufactured using high voltage multi-epitaxial planar technology for high switching speeds and high voltage capability. It uses a hollow emitter structure to enhance switching speeds.
3 2 1
TO-220
Figure 1. Internal schematic diagram
Table 1. Device summary
Order code
Marking (1)
Package
Packaging
ST13009
13009 L 13009 H
TO-220
Tube
1. Product is pre-selected in DC current gain.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 13009 |
Jingdao |
PNP power transistor | |
2 | 13009 |
STMicroelectronics |
NPN power transistor | |
3 | 13009L |
Fairchild Semiconductor |
KSE13009L | |
4 | 13009L |
STMicroelectronics |
NPN power transistor | |
5 | 13009SDL |
Jingdao |
Bipolar Junction Transistor | |
6 | 1300 |
Nihon Dempa Kogyo |
Crystal Clock Oscillators | |
7 | 1300-102-4xx |
Methode Electronics |
2.54mm IDC Connector | |
8 | 13001 |
Elite |
NPN Epitaxial Silicon Transistor | |
9 | 13001-2 |
Jingdao |
NPN power transistor | |
10 | 13001-A |
Jingdao |
NPN power transistor | |
11 | 13001S |
ETC |
Low-frequency amplification environment rated bipolar transistors | |
12 | 13001S8D |
JTD |
NPN Transistor |