| No. | Partie # | Fabricant | Description | Fiche Technique |
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Mitsubishi Electric Semiconductor |
Silicon RF Power MOSFET High power gain and High Efficiency. Typical Po Gp ηD (175MHz) 7.2W 13.8dB 65% (527MHz) 8W 13.0dB 63% (870MHz) 7W 11.5dB 58% Integrated gate protection diode. 3 (0.25) (0.25) INDEX MARK (Gate) 0.2+/-0.05 0.9+/-0.1 Terminal No. 1.Drain (output) 2 |
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Taiwan Semiconductor |
24V ESD Protection Array ● Small package for use in portable electronics ● Meet IEC61000-4-2(ESD) ±30kV(air) , ±30kV(contact) ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21 APPLICATIONS ● High Speed Line: USB |
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Thinki Semiconductor |
2.0 Ampere Surface Mount Glass Passivated Standard Rectifier Diodes ¬ Low forward voltage drop ¬ High current capability ¬ Low reverse leakage current ¬ High surge current capability ¬ Glass passivated chip for Automotive Mechanical Data ¬ Case: Molded plastic SMA/DO-214AC ¬ Epoxy: UL 94V-0 rate flame retardant ¬ Ter |
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Union Semiconductor |
Dual Line ESD Protection Diode Array z Cellular Handsets & Accessories z Cordless Phones z Personal Digital Assistants (PDA’s) z Notebooks & Handhelds z Portable Instrumentation z Digital Cameras z Peripherals z MP3 Players z Transient Protection for Data & Power Lines to IEC 61000-4- |
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Taiwan Semiconductor |
High Efficient Surface Mount Rectifiers - Glass passivated junction chip - Ideal for automated placement - Low profile package - Fast switching for high efficiency - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/9 |
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Fairchild Semiconductor |
Super Fast Surface Mount Rectifiers • Glass Passivated Chip Junction • High Surge Capacity • Low Forward Voltage Drop • Fast Switching with Reverse Recovery Time: 50~75 ns Maximum • UL Flammability 94V-0 Classification • MSL 1 per J-STD-020 • RoHS Compliant / Green Molding Compound • I |
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Taiwan Semiconductor |
(HS2A - HS2M) High Efficient Surface Mount Rectifiers Glass passivated junction chip. For surface mounted application Low forward voltage drop Low profile package Built-in stain relief, ideal for automatic placement Fast switching for high efficiency High temperature soldering: o 260 C/10 seconds at ter |
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Thinki Semiconductor |
(ES2AA - ES2JA) 2.0 AMPERE SURFACE MOUNT SUPER FAST RECTIFIERS For surface mounted application Low profile package Built-in strain relief Ideal for automated placement Easy pick and place Superfast recovery time for high efficiency High temperature soldering: O 260 C/10 seconds at terminals Plastic material used |
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Taiwan Semiconductor |
Super Fast Rectifier ● AEC-Q101 qualified ● Glass passivated chip junction ● Ideal for automated placement ● Low profile package ● Super fast recovery time for high efficiency ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according |
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Taiwan Semiconductor |
Surface Mount Fast Recovery Rectifiers - Glass passivated chip junction - Ideal for automated placement - Fast switching for high efficiency - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free ac |
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General Semiconductor |
SURFACE MOUNT FAST EFFICIENT PLASTIC RECTIFIER 0.086 (2.20) 0.077 (1.95) 0.155 (3.94) 0.130 (3.30) 0.180 (4.57) 0.160 (4.06) 0.012 (0.305) 0.006 (0.152) 0.096 (2.44) 0.084 (2.13) ¨ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ¨ For surface mount applications |
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General Semiconductor |
SURFACE MOUNT GLASS PASSIVATED SILICON RECTIFIER ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ For surface mounted applications ♦ Low profile package ♦ Built-in strain relief, ideal for automated placement ♦ Glass passivated chip junction ♦ High temperature solde |
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FEC Semiconductor |
2.0A Surface Mount Ultra Fast Recovery Rectifier The plastic package carries Underwriters Laboratory Flammability Classification 94V-0 For surface mounted applications Ultra fast switching for high efficiency Low reverse leakage Built-in strain relief, ideal for automated placement High forward sur |
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Hynix Semiconductor |
4Banks x 2M x 16bits Synchronous DRAM Standard SDR Protocol Internal 4bank operation ● Voltage : VDD = 1.8V, VDDQ = 1.8V ● LVCMOS compatible I/O Interface ● Low Voltage interface to reduce I/O power ● Low Power Features - PASR(Partial Array Self Refresh) - Auto TCSR (Temperature Compensa |
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Hynix Semiconductor |
4Banks x 2M x 16bits Synchronous DRAM Standard SDR Protocol Internal 4bank operation ● Voltage : VDD = 1.8V, VDDQ = 1.8V ● LVCMOS compatible I/O Interface ● Low Voltage interface to reduce I/O power ● Low Power Features - PASR(Partial Array Self Refresh) - Auto TCSR (Temperature Compensa |
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Hynix Semiconductor |
4Banks x 2M x 16bits Synchronous DRAM Standard SDR Protocol Internal 4bank operation ● Voltage : VDD = 1.8V, VDDQ = 1.8V ● LVCMOS compatible I/O Interface ● Low Voltage interface to reduce I/O power ● Low Power Features - PASR(Partial Array Self Refresh) - Auto TCSR (Temperature Compensa |
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Hynix Semiconductor |
4Banks x 2M x 16bits Synchronous DRAM Standard SDR Protocol Internal 4bank operation ● Voltage : VDD = 1.8V, VDDQ = 1.8V ● LVCMOS compatible I/O Interface ● Low Voltage interface to reduce I/O power ● Low Power Features - PASR(Partial Array Self Refresh) - Auto TCSR (Temperature Compensa |
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Mitsubishi Electric Semiconductor |
Silicon MOSFET Power Transistor •High power gain and High Efficiency. Pout 1.6W Typ, Gp 15dBTyp, 70%Typ 0.4+/-0.07 0.5+/-0.07 0.4+/-0.07 TYPE NAME 0.8 MIN 2.5+/-0.1 4.4+/-0.1 1.6+/-0.1 LOT No. 1 0. φ 1.5+/-0.1 1 2 1.5+/-0.1 3 1.5+/-0.1 0.4 +0.03 -0.05 Terminal No. 1 : GATE 2 |
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Taiwan Semiconductor |
50V - 600V Super Fast Surface Mount Rectifier ● Glass passivated chip junction ● Ideal for automated placement ● Low profile package ● Super fast recovery time for high efficiency ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21 APP |
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Taiwan Semiconductor |
Surface Mount Super Fast Rectifiers ● Glass passivated chip junction ● Ideal for automated placement ● Low profile package ● Super fast recovery time for high efficiency ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21 APP |
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