TSSOP - STATS ChipPAC

TSSOP Small Outline Packages

STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two sides with lead count ranging from 8 to 5.

Features

TSSOP
• Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
• Lead Count: 8L to 56L
• Lead Pitch: 0.50mm & 0.65mm
• Package Height: 1.20mm max.
• JEDEC standard compliant (MO-153)
• Lead-free (Pb-free) and Green
• Thermal Enhancements: ep (exposed pad) MSOP
• Body Size: 3 x 3mm
• Lead Count: 8L & 10L
• Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
• JEDEC standard compliant
• Lead-free (Pb-free) and Green
• Thermal enhancements: ep (exposed pad) DESCRIPTION STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small .