LSI Assembly TSSOP-B8/B8J (Units : mm) • TSSOP-B8/B8J 3.0 8 5 3.0 8 5 6.4 4.4 4.9 3.0 1 4 1 4 H=1.2Max. H=1.1Max. The contents described herein are subject to change without notice. www.DataSheet.in Appendix Notes No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM.
of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or comme.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | TSSOP-B8 |
Rohm |
LSI Assembly | |
2 | TSSOP-B14J |
Rohm |
IC Packages | |
3 | TSSOP-14PIN |
International Rectifier |
TSSOP Package 14-Pin | |
4 | TSSOP-16 |
RFM |
16-Pin Ceramic Case | |
5 | TSSOP-16 |
Fairchild Semiconductor |
16 Lead TSSOP Package Dimensions | |
6 | TSSOP-20 |
ETC |
Mechanical Dimensions | |
7 | TSSOP-8 |
Alpha & Omega Semiconductors |
Tape and Reel Dimensions | |
8 | TSSOP-8PIN |
International Rectifier |
Package Dimensions | |
9 | TSSOP-C10J |
Rohm |
LSI Assembly | |
10 | TSSOP-C48V |
Rohm |
LSI Assembly | |
11 | TSSOP |
STATS ChipPAC |
Small Outline Packages | |
12 | TSSOP14 |
STMicroelectronics |
14-LEAD THIN SHRINK SMALL OUTLINE |