LSI Assembly TSSOP-C48V • TSSOP-C48V 12.5±0.1 (MAX 12.85 include BURR) 48 25 4¼ +6¼ -4¼ 8.1±0.2 6.1±0.1 0.5 1.0MAX 1 1PIN MARK 24 S 0.85±0.05 0.08±0.08 0.5 0.08 S 0.22 -0.04 +0.05 0.08 M (Units : mm) The contents described herein are subject to change without notice. www.DataSheet.in 0.5±0.15 1.0±0.2 0.17 -0.03 +0.05 Appendix Notes No tec.
such as extra margin, anti-flammability, and fail-safe measures when designing in order to prevent possible accidents that may result in bodily harm or fire caused by component failure. ROHM cannot be held responsible for any damages arising from the use of the products under conditions out of the range of the specifications or due to non-compliance with the NOTES specified in this catalog. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact your nearest sales office. ROHM Customer Support System www.rohm.com.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | TSSOP-C10J |
Rohm |
LSI Assembly | |
2 | TSSOP-14PIN |
International Rectifier |
TSSOP Package 14-Pin | |
3 | TSSOP-16 |
RFM |
16-Pin Ceramic Case | |
4 | TSSOP-16 |
Fairchild Semiconductor |
16 Lead TSSOP Package Dimensions | |
5 | TSSOP-20 |
ETC |
Mechanical Dimensions | |
6 | TSSOP-8 |
Alpha & Omega Semiconductors |
Tape and Reel Dimensions | |
7 | TSSOP-8PIN |
International Rectifier |
Package Dimensions | |
8 | TSSOP-B14J |
Rohm |
IC Packages | |
9 | TSSOP-B8 |
Rohm |
LSI Assembly | |
10 | TSSOP-B8J |
Rohm |
LSI Assembly | |
11 | TSSOP |
STATS ChipPAC |
Small Outline Packages | |
12 | TSSOP14 |
STMicroelectronics |
14-LEAD THIN SHRINK SMALL OUTLINE |