Design Support Document IC Packages TSSOP-B14J 5.0±0.1 (Max 5.35 include BURR) 14 8 4º ±4º 6.4±0.2 4.4±0.1 0.55 1.0±0.05 1 7 1PIN MARK S +0.05 0.145 –0.03 1.2MAX 0.1±0.05 0.08 S 0.65 +0.05 0.245 –0.04 0.08 M 0.5±0.15 www.rohm.com © 2009 ROHM Co., Ltd. All rights reserved. 1.0±0.2 (Unit : mm) 1/2 2009.07 - Rev. A www.DataSheet.in Notice N.
account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | TSSOP-B8 |
Rohm |
LSI Assembly | |
2 | TSSOP-B8J |
Rohm |
LSI Assembly | |
3 | TSSOP-14PIN |
International Rectifier |
TSSOP Package 14-Pin | |
4 | TSSOP-16 |
RFM |
16-Pin Ceramic Case | |
5 | TSSOP-16 |
Fairchild Semiconductor |
16 Lead TSSOP Package Dimensions | |
6 | TSSOP-20 |
ETC |
Mechanical Dimensions | |
7 | TSSOP-8 |
Alpha & Omega Semiconductors |
Tape and Reel Dimensions | |
8 | TSSOP-8PIN |
International Rectifier |
Package Dimensions | |
9 | TSSOP-C10J |
Rohm |
LSI Assembly | |
10 | TSSOP-C48V |
Rohm |
LSI Assembly | |
11 | TSSOP |
STATS ChipPAC |
Small Outline Packages | |
12 | TSSOP14 |
STMicroelectronics |
14-LEAD THIN SHRINK SMALL OUTLINE |