This product utilizes the 5th generation of design rules of ST’s proprietary STripFET™ technology. The lowest available RDS(on)*Qg, in this chip scale package, makes this device suitable for the most demanding DC-DC converter applications, where high power density is to be achieved. Table 1. Device summary Order code Marking 15N3LLH5 Package PowerFLAT™ (3..
Type STL15N3LLH5 VDSS 30V RDS(on) <0.0054Ω ID 15A (1)
1. The value is rated according Rthj-pcb
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RDS(on)
* Qg industry benchmark Extremely low on-resistance RDS(on) Very low switching gate charge High avalanche ruggedness Low gate drive power losses
PowerFLAT™(3.3x3.3) (Chip scale package)
Applications
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Switching applications
Figure 1.
Internal schematic diagram
Description
This product utilizes the 5th generation of design rules of ST’s proprietary STripFET™ technology. The lowest available RDS(on)
*Qg, in this chip scale package, makes this device suitable for the most demandi.
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