A0-A10 Address Input BA0, BA1 Bank Select Address I/O0 to I/O31 Data I/O CLK System Clock Input CKE CS Clock Enable Chip Select RAS Row Address Strobe Command CAS WE Column A.
• Clock frequency: 166, 143 MHz
• Fully synchronous; all signals referenced to a
positive clock edge
• Internal bank for hiding row access/precharge
• Single 3.3V power supply
• LVTTL interface
• Programmable burst length
– (1, 2, 4, 8, full page)
• Programmable burst sequence:
Sequential/Interleave
• Self refresh modes
• 4096 refresh cycles every 64 ms
• Random column address every clock cycle
• Programmable CAS latency (2, 3 clocks)
• Burst read/write and burst read/single write
operations capability
• Burst termination by burst stop and precharge
command
• Industrial temperature availabilit.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | IS42S32200E |
ISSI |
SYNCHRONOUS DYNAMIC RAM | |
2 | IS42S32200L |
ISSI |
64-MBIT SYNCHRONOUS DYNAMIC RAM | |
3 | IS42S32200N |
ISSI |
64-MBIT SYNCHRONOUS DYNAMIC RAM | |
4 | IS42S32160D |
ISSI |
512Mb SDRAM | |
5 | IS42S32160F |
ISSI |
512Mb SDRAM | |
6 | IS42S32400A |
Integrated Circuit Solution |
128-MBIT SYNCHRONOUS DRAM | |
7 | IS42S32400E |
ISSI |
128Mb SYNCHRONOUS DRAM | |
8 | IS42S32400F |
ISSI |
4M x 32 128Mb SYNCHRONOUS DRAM | |
9 | IS42S32800 |
ISSI |
2M Words x 32 Bits x 4 Banks (256-Mbit) Synchronous DRAM | |
10 | IS42S32800B |
Integrated Silicon Solution |
SYNCHRONOUS DYNAMIC RAM | |
11 | IS42S32800D |
Integrated Silicon Solution |
8M x 32 256Mb SYNCHRONOUS DRAM | |
12 | IS42S32800G |
ISSI |
256Mb SYNCHRONOUS DRAM |