The EPC2112 enhancement-mode gallium-nitride (eGaN®) integrated driver and FET consists of a 40-mΩ, 200 V eGaN power transistor and an optimized gate driver in a low inductance 2.9 mm by 1.1 mm surfacemount BGA. The EPC2112 monolithic IC enables designers to improve efficiency, save space, and lower costs compared to silicon-based solutions. The ultra-low ca.
• Integrated Gate Driver
– Low Propagation Delay
– Up to 7 MHz Operation
– Operates from 5 V Supply
• 200 V, 40-mΩ eGaN FET
• Low Inductance 2.9 mm x 1.1 mm BGA
EPC2112 devices are supplied only in passivated die form with solder balls
Die Size: 2.9 mm x 1.1 mm
APPLICATIONS:
• Wireless Power (Highly Resonant and Inductive)
• High Frequency DC-DC Conversion
Schematic Diagram
DESCRIPTION The EPC2112 enhancement-mode gallium-nitride (eGaN®) integrated driver and FET consists of a 40-mΩ, 200 V eGaN power transistor and an optimized gate driver in a low inductance 2.9 mm by 1.1 mm surfacemount.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | EPC2111 |
EPC |
Enhancement-Mode GaN Power Transistor Half-Bridge | |
2 | EPC2115 |
EPC |
Integrated Gate Driver eGaN | |
3 | EPC21.9 |
ACME |
EPC Cores | |
4 | EPC2 |
Altera Corporation |
Configuration Devices | |
5 | EPC20 |
ACME |
EPC Cores | |
6 | EPC2001 |
EPC |
Power Transistor | |
7 | EPC2001C |
EPC |
Power Transistor | |
8 | EPC2007 |
EPC |
Power Transistor | |
9 | EPC2010 |
EPC |
Power Transistor | |
10 | EPC2010C |
EPC |
Power Transistor | |
11 | EPC2012 |
EPC |
Power Transistor | |
12 | EPC2012C |
EPC |
Power Transistor |