Recherchez avec le numéro de pièce ainsi que le fabricant ou la description
PROCESS www.DataSheet4U.com CPQ165 TRIAC 25 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 376 PRINCIPAL DEVICE TYPES CQDD-25M Series CQ220-25M Series CQ220-25MFP Series Glass Passivated Mesa 165 x 165 MILS 8.
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| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | CPQ166 |
centralsemi |
TRIAC |
|
| 2 | CPQ110 |
Central Semiconductor |
Triac 8.0 Amp |
|
| 3 | CPQ130 |
Central Semiconductor |
Triac 12 Amp |
|
| 4 | CPQ150 |
Central Semiconductor Corporation |
16A 600V Triac Chip |
|
| 5 | CPQ057 |
Central Semiconductor |
TRIAC 2.0 Amp |
|
| 6 | CPQ090 |
Central Semiconductor |
TRIAC 4.0 Amp |
|
| 7 | CP-20K42 |
ETC |
CP-20K42 |
|
| 8 | CP-20K42A |
LG |
Color TV Manual |
|
| 9 | CP-4LB |
Sumida Corporation |
IFT Coils |
|
| 10 | CP-H0114-C |
Coilcraft |
SMD Telecoil |
|
| 11 | CP0002 |
Vishay |
Wirewound/Metal Oxide Resistors |
|
| 12 | CP0003 |
Vishay |
Wirewound/Metal Oxide Resistors |
|