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PROCESS www.DataSheet4U.com CPQ057 TRIAC 2.0 Amp, 600 Volt TRIAC Chip PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 3,374 PRINCIPAL DEVICE TYPES CQ92-2M CQ223-2M CQ89-2M Glass Passivated Mesa 57 x 57 MILS 8.6 MILS ± 0.6 MILS 28 x 16.
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| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | CPQ090 |
Central Semiconductor |
TRIAC 4.0 Amp |
|
| 2 | CPQ110 |
Central Semiconductor |
Triac 8.0 Amp |
|
| 3 | CPQ130 |
Central Semiconductor |
Triac 12 Amp |
|
| 4 | CPQ150 |
Central Semiconductor Corporation |
16A 600V Triac Chip |
|
| 5 | CPQ165 |
Central Semiconductor |
TRIAC 25 Amp |
|
| 6 | CPQ166 |
centralsemi |
TRIAC |
|
| 7 | CP-20K42 |
ETC |
CP-20K42 |
|
| 8 | CP-20K42A |
LG |
Color TV Manual |
|
| 9 | CP-4LB |
Sumida Corporation |
IFT Coils |
|
| 10 | CP-H0114-C |
Coilcraft |
SMD Telecoil |
|
| 11 | CP0002 |
Vishay |
Wirewound/Metal Oxide Resistors |
|
| 12 | CP0003 |
Vishay |
Wirewound/Metal Oxide Resistors |
|