Central www.DataSheet4U.com TM PROCESS CPQ150 Triac Semiconductor Corp. 16 Amp, 600 Volt Triac Chip PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 150 MILS x 150 MILS 8.6 MILS ± 0.6 MILS 68.9 MILS x 118 MILS 39.4 MILS x 39.4 MILS Al - 45,000Å A.
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | CPQ110 |
Central Semiconductor |
Triac 8.0 Amp | |
2 | CPQ130 |
Central Semiconductor |
Triac 12 Amp | |
3 | CPQ165 |
Central Semiconductor |
TRIAC 25 Amp | |
4 | CPQ166 |
centralsemi |
TRIAC | |
5 | CPQ057 |
Central Semiconductor |
TRIAC 2.0 Amp | |
6 | CPQ090 |
Central Semiconductor |
TRIAC 4.0 Amp | |
7 | CP-20K42 |
ETC |
CP-20K42 | |
8 | CP-20K42A |
LG |
Color TV Manual | |
9 | CP-4LB |
Sumida Corporation |
IFT Coils | |
10 | CP-H0114-C |
Coilcraft |
SMD Telecoil | |
11 | CP0002 |
Vishay |
Wirewound/Metal Oxide Resistors | |
12 | CP0003 |
Vishay |
Wirewound/Metal Oxide Resistors |