C527UT190 - CREE

C527UT190 LED

P-N Junction Area (μm) Chip Top Area (μm) Chip Bottom Area (μm) Chip Thickness (μm) Au Bond Pad Diameter (μm) Bonding Area Note 5 Diameter (μm) Au Bond Pad Thickness (μm) Backside Contact Metal Area (μm) CxxxUT190-Sxxxx-31 Dimension Tolerance 160 x 160 ± 25 190 x 190 ± 25 150 x 150 ± 25 50 ± 10 85 -5, +15 70 -5, +15 1.2 ± 0.5 80 x 80 ± 25 .

Features

• Wavelengths for Blue, Green and White-conversion
• 50 mm Chip Thickness
• RF Performance:
  – 450 nm
  – 12+ mW
  – 460 nm
  – 10+ mW
  – 470 nm
  – 10+ mW
  – 527 nm
  – 4+ mW
• Low Forward Voltage
  – 2.9 V Typical at 5 mA
• Conductive Adhesive Die Attach
• Single Wire Bond, Vertically Conductive Structure
• 2kV Class 2 ESD Rating CxxxUT190-Sxxxx-31 Chip Diagram APPLICATIONS
• Indicator Applications
  – Consumer Products
  – Mobile Devices
  – Product Displays
  – White Goods
• Automotive Applications
  – Interior Indicators
  – Meter Cluster Lighting
  – Center Stack Displays Top View Anode (+), Ф85 mm (B.