|
Features
|
e 1
Symbol
Value
SPP_B SPA
ID
11
111)
7
71)
ID puls
22
22
EAS
340
340
Unit A
A mJ
EAR
0.6
0.6
IAR
11
11 A
dv/dt
6
6 V/ns
VGS VGS Ptot Tj , Tstg
±20
±20 V
±30
±30
125
33 W
-55...+150
°C
2002-08-12
Final data
SPP11N60C2, SPB11N60C2 SPA11N60C2
Thermal Characteristics Parameter
Characteristics Thermal resistance, junction - case Thremal resistance, junction - case, FullPAK Thermal resistance, junction - ambient, leaded Thermal resistance, junction - ambient, FullPAK SMD version, device on PCB: @ min. footprint @ 6 cm2 cooling area 3) Linear derating factor Line...
|
Click to view a larger image
11N60C2 Data Sheet
