| No. | Partie # | Fabricant | Description | Fiche Technique |
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IXYS |
Distributed Gate Thyristor |
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IXYS |
Distributed Gate Thyristor |
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IXYS Corporation |
HiPerFETTM Power MOSFETs • Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation • Low drain to tab capacitance(<30pF) • Low RDS (on) HDMOSTM process • Rugged polysilicon gate cell structure • Unclamped |
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IXYS Corporation |
(IXFR24N50 / IXFR26N50) HiPerFET Power MOSFETs W °C °C °C °C V~ g • Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation • Low drain to tab capacitance(<50pF) • Low RDS (on) HDMOSTM process • Rugged polysilicon gate cell st |
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IXYS Corporation |
(IXFR24N50 / IXFR26N50) HiPerFET Power MOSFETs W °C °C °C °C V~ g • Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation • Low drain to tab capacitance(<50pF) • Low RDS (on) HDMOSTM process • Rugged polysilicon gate cell st |
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IXYS Corporation |
(IXFR24N50Q / IXFR26N50Q) HiPerFET Power MOSFETs l Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation l Low drain to tab capacitance(<35pF) l Low RDS (on) HDMOSTM process l Rugged polysilicon gate cell structure l Unclamped |
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IXYS Corporation |
(IXFR24N50Q / IXFR26N50Q) HiPerFET Power MOSFETs l Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation l Low drain to tab capacitance(<35pF) l Low RDS (on) HDMOSTM process l Rugged polysilicon gate cell structure l Unclamped |
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IXYS |
Distributed Gate Thyristor |
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IXYS |
Distributed Gate Thyristor |
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|
IXYS |
Distributed Gate Thyristor |
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|
IXYS Corporation |
HiPerFASTTM IGBT ISOPLUS247TM l l l l l Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s VISOL Weight 50/60 Hz, RMS, t = 1minute leads-to-tab DCB Isolated mounting tab Meets TO-247AD package Outline High current handling capability Latest generation |
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