THGBM5G5A1JBAIR - Toshiba

THGBM5G5A1JBAIR 4GB e-MMC Module

THGBM5G5A1JBAIR 4GB THGBM5G5A1JBAIR TOSHIBA e-MMC Module INTRODUCTION THGBM5G5A1JBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G5A1JBAIR has an industry standard MMC protocol for easy use. FEATURES THGBM.

Features

THGBM5G5A1JBAIR Interface THGBM5G5A1JBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Furthermore following several new functions that defined in JEDEC/MMCA Version 4.5 were supported. - 200MHz SDR / Sanitize / Discard / Packed command 8/ Power off notification / Large sector size Pin Connection P-VFBGA153-1113-0.50-002 (11.5 x 13mm, H1.0mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC RFU RFU RFU Vss Vcc.