THGBM4G7D2GBAIE - Toshiba

THGBM4G7D2GBAIE 16GB e-MMC Module

THGBM4G7D2GBAIE 16GB THGBM4G7D2GBAIE INTRODUCTION TOSHIBA e-MMC Module THGBM4G7D2GBAIE is 16-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM4G7D2GBAIE has an industry standard MMC protocol for easy use. FEATURES THGB.

Features

THGBM4G7D2GBAIE Interface THGBM4G7D2GBAIE has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Pin Connection P-TFBGA169-1216-0.50A4 (12 x 16mm, H1.2mm max. package) 14 13 NC 12 11 NC 10 9 NC 8 7 6 NC 5 4 NC 3 2 NC 1 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC RFU RFU RFU Vss Vcc RFU NC NC RFU NC NC NC RFU Vcc NC NC NC NC NC NC RFU NC NC RFU Vss Top View Vss RFU NC NC NC NC NC RFU RFU DAT7 VccQ Vcc RFU CLK NC VssQ DAT2 .