THGBM4G5D1HBAIR - Toshiba

THGBM4G5D1HBAIR 4GB e-MMC Module

THGBM4G5D1HBAIR TOSHIBA e-MMC Module 4GB THGBM4G5D1HBAIR INTRODUCTION THGBM4G5D1HBAIR is 4-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module. THGBM4G5D1HBAIR has an industry standard MMC protocol for easy use. FEATURES THGBM4G5D1HBA.

Features

THGBM4G5D1HBAIR Interface THGBM4G5D1HBAIR has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Ball / Signal Allocation P-VFBGA153-1113-0.50-002 (11.5 x 13mm, H1.0mm max. package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC RFU RFU RFU Vss Vcc RFU NC NC RFU 9 NC NC NC RFU Vcc NC NC NC 8 NC NC NC 7 RFU NC NC RFU Vss Top View Vss RFU NC NC NC NC NC RFU 6 RFU DAT7 VccQ Vcc RFU CLK NC VssQ 5 DAT2 DAT6 RFU RFU Vcc Vss.