S71WS512N - SPANSION

S71WS512N Stacked Multi-Chip Product (MCP)

of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, a.

Features

„ Power supply voltage of 1.7 V to 1.95 V „ Burst Speed: 54 MHz, 66 MHz, 80 MHz „ Package
  – 8 x 11.6 mm, 9 x 12 mm „ Operating Temperature
  – Wireless,
  –25° C to +85° C General Description The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items: „ One or more flash memory die (for the S71WS512N, two S29WS256N devices are used) „ CellularRAM Type 2 pSRAM The products covered by this document are listed in the table below. For details about their specifications, please refer to the individual constituent datasheet for further details.