of Spansion data sheet designations are presented here to highlight their presence and definitions. Advance Information The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, a.
Power supply voltage of 1.7 to 1.95V Flash access time: 80 ns, 25 ns Flash burst frequencies: 66 MHz, 80 MHz, 108 MHz pSRAM Access time: 70 ns, 20 ns pSRAM burst frequency: 66 MHz, 80 MHz, 104 MHz Package:
– 8.0 x 11.6 mm MCP
Operating Temperature
–
–25°C to +85°C (wireless)
The S71WS series is a product line of stacked packages and consists of: One or two S29WS-P NOR flash memory die CellularRAM die The products covered by this document are listed in the table below.
CellularRAM Density (Mb) Device S29WS512P 64 Mb S71WS512PC0 128 Mb S71WS512PD0
Note: For a full list of OP.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | S71WS-J |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
2 | S71WS-N |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
3 | S71WS-NX0 |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
4 | S71WS064J |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
5 | S71WS128J |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
6 | S71WS128N |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
7 | S71WS128NX0 |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
8 | S71WS145NX0 |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
9 | S71WS256J |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
10 | S71WS256N |
SPANSION |
Stacked Multi-Chip Product (MCP) | |
11 | S71WS256P |
SPANSION |
Burst Mode Flash Memory | |
12 | S71WS512N |
SPANSION |
Stacked Multi-Chip Product (MCP) |