STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal performance. TQFP-ep-SD is a thin profile exposed pad version with enhanced thermal performance. STATS ChipPAC’s chip stacking technology allows the integration of m.
• Combining devices into one package reduces PCB real estate and cost
• Increased sub-system performance by integrating multiple chips into a single package
• Die to die bonding capability for device/signal integration
• Standard and green/lead-free materials and Pb-free plating
• Options for mixed technologies, 2 or more stacked dice
• Fine pitch bonding capability
• Exposed pad provides enhanced thermal performance
• Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD)
• Lead pitch ranges from 0.80mm to 0.40mm
• Pin count ranges from 32 to 208 leads (LQFP-SD).
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | QFP-A64 |
Rohm |
LSI Assembly | |
2 | QFP-EP |
STATS ChipPAC |
Exposed Pad Quad Flat Pack | |
3 | QFP-T80 |
Rohm |
LSI Assembly | |
4 | QFP44 |
iSYSTEM |
POD Target Layout | |
5 | QFP44 |
iSYSTEM |
TET | |
6 | QFP44 |
Rohm |
LSI Assembly | |
7 | QFP44 |
ETC |
SMD Adapter Board | |
8 | QFP56 |
LAPIS |
LSI Package | |
9 | QF0900Q06A |
Yantel |
Quadrifilar Directional Coupler | |
10 | QF1200Q06A |
Yantel |
Quadrifilar Directional Coupler | |
11 | QF132V1.00 |
WinMate |
DC-AC INVERTER | |
12 | QF15AA40 |
ETC |
TRANSISTOR MODULE THREE PHASES BRIDGE TYPE |