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QFP-SD |
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| Part Number | QFP-SD |
| Manufacturer | STATS ChipPAC |
| Description | STATS ChipPAC’s Stacked Die QFP offering includes LQFPSD, LQFP-ep-SD and TQFP-ep-SD. LQFP-SD is a stacked die low profile QFP. LQFP-ep-SD is an exposed pad version that provides enhanced thermal perfo... |
| Features |
• Combining devices into one package reduces PCB real estate and cost • Increased sub-system performance by integrating multiple chips into a single package • Die to die bonding capability for device/signal integration • Standard and green/lead-free materials and Pb-free plating • Options for mixed technologies, 2 or more stacked dice • Fine pitch bonding capability • Exposed pad provides enhanced thermal performance • Low profile package thickness of 1.40mm (LQFP-SD and LQFP-ep-SD); 1.00mm (TQFP-ep-SD) • Lead pitch ranges from 0.80mm to 0.40mm • Pin count ranges from 32 to 208 leads (LQFP-SD)... |
| Document |
 QFP-SD Data Sheet
PDF 647.87KB |
| Distributor | Stock | Price | Buy |
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