QFP-EP - STATS ChipPAC

QFP-EP Exposed Pad Quad Flat Pack

STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC’s QFP-ep family includes the Exposed Pad-Low Profile QFP (LQFP-ep) and the Exposed Pad-Thin Q.

Features

• Body Sizes: 7 x 7mm to 24 x 24mm
• Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep)
• Lead Counts: 32L to 216L
• Lead Pitch: 0.40mm to 0.80mm
• Wide range of open tool leadframe and die pad sizes available
• JEDEC standard compliant
• Lead-free and Green material sets available DESCRIPTION STATS ChipPAC’s Exposed Pad Quad Flat Pack (QFP-ep) is a thermally enhanced version of the QFP package. Thermal enhancement is achieved by means of an exposed die pad, which can be soldered to a mother PC board for effective heat removal and grounding. STATS ChipPAC’s QFP-ep family includes the Exposed.