PI3042A - AMI SEMICONDUCTOR

PI3042A Contact Image Sensor Chip

Peripheral Imaging Corporation PI3042A CIS, Contact Image Sensor is a 400 dot per inch (dpi) resolution, linear array image sensor chip. The sensor chip is processed using PIC’s proprietary CMOS Image Sensor Technology. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed .

Features

ice automation equipment which requires a wide variety of scanning widths. Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 128 detector elements, their associated multiplexing switches, buffers, and a chip selector. The detectors element-to-element spacing is approximately 62.5 µm. The size of each chip without scribe lines is 8080 µm by 385 µm. Each sensor chip has 7 bonding pads. The pad symbols and functions are described in Table 1. 8080µm 1 2 3 4 Row of 128 Sensors 125 and Video Signal Multiplexers Readout Shift Register 126 127 128 385µm Buffer.