PI3033B - AMI SEMICONDUCTOR

PI3033B Contact Image Sensor

Peripheral Imaging Corporation PI3033B CIS, Contact Image Sensor, chip is a 200 dot per inch resolution, linear array image sensor chip. The sensor chip is processed with PIC’s proprietary CMOS Image Sensing Technology. Designed for cascading multiple chips in a series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a printed .

Features

ip selector. The detector's elementto-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by 500 um. Each sensor chip has 8 bonding pads. Only 7 are used to make the CIS Modules. The pad symbols and functions are described in Table 1. 7950 m Row of 64 Sensors and Video Signal Multiplexers Readout Shift Register 500 m Buffer SP Buffer CP VDD DGND Chip Select IOUT RSTLEV Buffer AGND EOS Figure 1. PI3033B Block Diagram SYMBOL SP CP VDD DGND RSTLEV IOUT AGND EOS FUNCTION Start Pulse: Input to start the line scan. Clock Pulse: Input to clock the Shif.