5. Added OTP erase case NOTE 6. Revised case definitions of Interrupt Status Register 7. Added a NOTE to Command register 8. Added ECClogSector Information table 9. Removed ’data unit based data handling’ from description of Device Operation 10. Revised description on Warm/Hot/NAND Flash Core Reset 11. Revised Warm Reset Timing 12. Revised description for 4-.
• Design Technology: 0.12µm
• Voltage Supply - 1.8V device(KFG2816Q1M) : 1.7V~1.95V - 3.3V device(KFG2816U1M) : 2.7V~3.6V
• Organization - Host Interface:16bit
• Internal BufferRAM(3K Bytes) - 1KB for BootRAM, 2KB for DataRAM
• NAND Array - Page Size : (1K+32)bytes - Block Size : (64K+2K)bytes
FLASH MEMORY
♦ Architecture
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♦ Performance
• Host Interface type - Synchronous Burst Read : Clock Frequency: up to 54MHz : Linear Burst - 4 , 8 , 16 , 32 words with wrap-around : Continuous Sequential Burst(512 words) - Asynchronous Random Read : Access time of 76ns - Asynchronous .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | KFG2816U1M-DIB |
Samsung semiconductor |
(KFG2816Q1M-DEB / KFG2816U1M-DIB) Flash Memory | |
2 | KFG2G16Q2M |
Samsung semiconductor |
2Gb OneNAND M-Die | |
3 | KFG1216D2A |
Samsung semiconductor |
FLASH MEMORY | |
4 | KFG1216D2M |
Samsung semiconductor |
FLASH MEMORY | |
5 | KFG1216Q2A |
Samsung semiconductor |
FLASH MEMORY | |
6 | KFG1216Q2M |
Samsung semiconductor |
FLASH MEMORY | |
7 | KFG1216U2A |
Samsung semiconductor |
FLASH MEMORY | |
8 | KFG1216U2M |
Samsung semiconductor |
FLASH MEMORY | |
9 | KFG1G1612M-DEB5 |
Samsung semiconductor |
FLASH MEMORY | |
10 | KFG1G16Q2A-DEBx |
Samsung Electronics |
FLASH MEMORY | |
11 | KFG1G16Q2C |
Samsung Electronics |
1Gb OneNAND C-die | |
12 | KFG1G16Q2M |
Samsung semiconductor |
FLASH MEMOR |