for below operations -. Reset -. Write Protection -. Burst Read Latency -. Dual Operation -. Invalid block definition and Identification method -. Error in write or read operation -. ECC 3. Revised program sequence 4. Some AC parameters are changed. tACH : 9ns-->7ns, tCES : 7ns-->9ns, tAAVDS : 5ns-->7ns tDS : 30ns-->10ns, tDH : 0ns-->4ns 5. Define new AC pa.
♦ Architecture
• Design Technology: 0.12um
• Voltage Supply - 1.8V device(KFG1216Q2M) : 1.7V~1.95V - 2.65V device(KFG1216D2M) : 2.4V~2.9V - 3.3V device(KFG1216U2M) : 2.7V~3.6V
• Organization - Host Interface:16bit
• Internal BufferRAM(5K Bytes) - 1KB for BootRAM, 4KB for DataRAM
• NAND Array - Page Size : (2K+64)bytes - Block Size : (128K+4K)bytes
FLASH MEMORY
♦ Performance
• Host Interface type - Synchronous Burst Read : Clock Frequency: up to 54MHz : Linear Burst - 4, 8, 16, 32 words with wrap-around : Continuous Sequential Burst(1K words) - Asynchronous Random Read : Access time of 76ns -.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | KFG1216U2A |
Samsung semiconductor |
FLASH MEMORY | |
2 | KFG1216D2A |
Samsung semiconductor |
FLASH MEMORY | |
3 | KFG1216D2M |
Samsung semiconductor |
FLASH MEMORY | |
4 | KFG1216Q2A |
Samsung semiconductor |
FLASH MEMORY | |
5 | KFG1216Q2M |
Samsung semiconductor |
FLASH MEMORY | |
6 | KFG1G1612M-DEB5 |
Samsung semiconductor |
FLASH MEMORY | |
7 | KFG1G16Q2A-DEBx |
Samsung Electronics |
FLASH MEMORY | |
8 | KFG1G16Q2C |
Samsung Electronics |
1Gb OneNAND C-die | |
9 | KFG1G16Q2M |
Samsung semiconductor |
FLASH MEMOR | |
10 | KFG1G16U2B |
Samsung semiconductor |
1Gb OneNAND B-die | |
11 | KFG1G16U2B-DIB6 |
Samsung semiconductor |
1Gb OneNAND B-die | |
12 | KFG2816Q1M-DEB |
Samsung semiconductor |
(KFG2816Q1M-DEB / KFG2816U1M-DIB) Flash Memory |