Recherchez avec le numéro de pièce ainsi que le fabricant ou la description
® Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver glue ) epoxy resin 0.25 mm 10-40 µm molding compound 3 mm 0.0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j.
.
| No. | Partie # | Fabricant | Description | Fiche Technique |
|---|---|---|---|---|
| 1 | DIP24 |
STMicroelectronics |
Thermal Data |
|
| 2 | DIP24-1A72-11 |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 3 | DIP24-1Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 4 | DIP24-1Bxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 5 | DIP24-2Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 6 | DIP-14 |
Saga |
DIP-14 |
|
| 7 | DIP-8 |
Advanced Analogic Technologies |
DUAL OPERATIONAL AMPLIFIERS |
|
| 8 | DIP-8 |
Advanced Analogic Technologies |
DUAL LOW NOISE OPERATIONAL AMPLIFIERS |
|
| 9 | DIP05-1Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 10 | DIP05-1Bxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 11 | DIP05-1Cxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|
| 12 | DIP05-2Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |
|