® Thermal Data DIP 24 24 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 µm molding compound 3 mm 0.0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 .
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | DIP20 |
ETC |
Thermal Data | |
2 | DIP24-1A72-11 |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
3 | DIP24-1Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
4 | DIP24-1Bxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
5 | DIP24-2Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
6 | DIP-14 |
Saga |
DIP-14 | |
7 | DIP-8 |
Advanced Analogic Technologies |
DUAL OPERATIONAL AMPLIFIERS | |
8 | DIP-8 |
Advanced Analogic Technologies |
DUAL LOW NOISE OPERATIONAL AMPLIFIERS | |
9 | DIP05-1Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
10 | DIP05-1Bxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
11 | DIP05-1Cxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
12 | DIP05-2Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |