DIP20 |
Part Number | DIP20 |
Manufacturer | ETC |
Description | ® Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver glue ) epoxy resin 0.25... |
Features |
... |
Document |
DIP20 Data Sheet
PDF 215.58KB |
Distributor | Stock | Price | Buy |
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No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | DIP24 |
STMicroelectronics |
Thermal Data | |
2 | DIP24-1A72-11 |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
3 | DIP24-1Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
4 | DIP24-1Bxx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays | |
5 | DIP24-2Axx-xx |
MEDER |
(DIP Series) Molded DIP Reed Relays |