.... 6 2. FEATURES 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS ...........
. 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .... 7 3.1 Pad Configuration WSON 8x6-mm .. 7 3.2 Pad Description WSON 8x6-mm...... 7 3.3 Pin Configuration SOIC 300-mil .
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | 25N01GVZEIT |
Winbond |
3V 1G-BIT SERIAL SLC NAND FLASH MEMORY | |
2 | 25N01GVSFIG |
Winbond |
3V 1G-BIT SERIAL SLC NAND FLASH MEMORY | |
3 | 25N01GVSFIT |
Winbond |
3V 1G-BIT SERIAL SLC NAND FLASH MEMORY | |
4 | 25N01GVTBIG |
Winbond |
3V 1G-BIT SERIAL SLC NAND FLASH MEMORY | |
5 | 25N01GVTBIT |
Winbond |
3V 1G-BIT SERIAL SLC NAND FLASH MEMORY | |
6 | 25N01GVTCIG |
Winbond |
3V 1G-BIT SERIAL SLC NAND FLASH MEMORY | |
7 | 25N01GVTCIT |
Winbond |
3V 1G-BIT SERIAL SLC NAND FLASH MEMORY | |
8 | 25N05 |
Inchange Semiconductor |
N-Channel MOSFET | |
9 | 25N06 |
Inchange Semiconductor |
N-Channel MOSFET | |
10 | 25N06 |
Unisonic Technologies |
N-CHANNEL POWER MOSFET | |
11 | 25N10 |
ROUM |
N-Channel MOSFET | |
12 | 25N10 |
Unisonic Technologies |
N-Channel MOSFET |