No. | Partie # | Fabricant | Description | Fiche Technique |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum pe |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum pe |
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Vishay |
Fast Avalanche Sinterglass Diode • Glass passivated junction • Hermetically sealed package • Low reverse current • Soft recovery characteristics • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 949539 MECHANICAL DATA Case: SOD-57 Termina |
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Vishay |
High Current Density Surface-Mount Rectifier • Very low profile - typical height of 1.1 mm Available • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualifie |
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Vishay |
High Current Density Surface Mount Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum pe |
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Vishay |
High Current Density Surface Mount Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum pe |
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Vishay |
Dual Trench MOS Barrier Schottky Rectifier • Trench MOS Schottky technology • Ideal for automated placement • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material categorization: For definitions of comp |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum pe |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum pe |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualifie |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum pe |
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Vishay |
Thick Film Chip Resistors • High operating voltage (up to 3 kV) • Low voltage coefficient of resistance (VCR): 25 ppm/V • UL 1676 recognition for RCV2010 e3 and RCV2512 e3 only; UL file no. E526561 • IEC 62368-1 ed. 3 compliant for RCV2010 e3 and RCV2512 e3 only • Material ca |
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Vishay |
Fast Avalanche Sinterglass Diode • Glass passivated junction • Hermetically sealed package • Low reverse current • Soft recovery characteristics • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 949539 MECHANICAL DATA Case: SOD-57 Termina |
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Vishay |
Fast Avalanche Sinterglass Diode • Glass passivated junction • Hermetically sealed package • Low reverse current • Soft recovery characteristics • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 949539 MECHANICAL DATA Case: SOD-57 Termina |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum pe |
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Vishay |
Thick Film Chip Resistors • High voltage up to 3000 V • Outstanding stability < 0.5 % • Flow solderable Available • Custom sizes available Available • Automatic placement capability • Tape and reel packaging available • Termination style: 3-sided wraparound terminatio |
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Vishay |
Dual Trench MOS Barrier Schottky Rectifier • Trench MOS Schottky technology • Ideal for automated placement • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Material categorization: For definitions of comp |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualifie |
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Vishay |
Trench MOS Barrier Schottky Rectifier • Very low profile - typical height of 1.1 mm Available • Trench MOS Schottky technology • Low forward voltage drop, low power losses • High efficiency operation • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualifie |
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Vishay |
Fast Avalanche Sinterglass Diode • Glass passivated junction • Hermetically sealed package • Low reverse current • Soft recovery characteristics • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 949539 MECHANICAL DATA Case: SOD-57 Termina |
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