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TE MS4 DataSheet

No. Partie # Fabricant Description Fiche Technique
1
AMS431

Advanced Monolithic Systems
PRECISION ADJUSTABLE SHUNT REGULATOR

• Trimmed 0.25% Reference
• Wide Operating Current Range 250µA to 150mA
• Low Dynamic Output Impedance
• Low Output Noise
• Nominal Temperature Range -40°C to 125°C
• Temperature-Compensated: 60ppm/°C typ
• Internal Amplifier with 150mA Capability A
Datasheet
2
AMS4041

Advanced Monolithic Systems
MICROPOWER SHUNT VOLTAGE REFERENCE

• Tight Output Voltage Tolerance
• Low Output Noise
• Operating Current 60µA to 100mA
• Low Dynamic Impedance
• Low Temperature Coefficient
• Available in the sub-miniature SOT-23 Package
• 2.5V Device ( AMS4040) also available AMS4041 MICROPOWER SH
Datasheet
3
AMS421

Advanced Monolithic Systems
0.5V SHUNT REGULATOR

• Trimmed 0.5% Tolerance
• Wide Operating Current Range 0.1µA to 10mA
• Low Reference Input Current 1.5nA
• Low Dynamic Output Impedance
• Low Output Noise
• Nominal Temperature Range to 125°C
• Temperature-Compensated: 50ppm/°C
• Low supply current:
Datasheet
4
AMS4123

Advanced Monolithic Systems
3A 20V Step-Down Converter + 1A LDO

• Step-Down Converter + LDO in SO-8EP
• Internally Compensated
• Up to 95% Efficiency
• Low ESR Ceramic Output Capacitor Stable
• Soft Start
• Under-Voltage Lockout
• Dual Threshold Enable
• 300 kHz Switching Frequency
• Hiccup Current Limit
• Over-T
Datasheet
5
TMS417409A

National Semiconductor
4194304 BY 4-BIT EXTENDED DATA OUT DYNAMIC RANDOM-ACCESS MEMORIES
maximum RAS access times of 50, 60, and 70 ns. All address and data-in lines are latched on chip to simplify system design. Data out is unlatched to allow greater system flexibility. POWER SUPPLY 5V 5V 3.3 V 3.3 V SELF REFRESH, BATTERY BACKUP
  –
  –
  –
Datasheet
6
TMS427409A

National Semiconductor
4194304 BY 4-BIT EXTENDED DATA OUT DYNAMIC RANDOM-ACCESS MEMORIES
maximum RAS access times of 50, 60, and 70 ns. All address and data-in lines are latched on chip to simplify system design. Data out is unlatched to allow greater system flexibility. POWER SUPPLY 5V 5V 3.3 V 3.3 V SELF REFRESH, BATTERY BACKUP
  –
  –
  –
Datasheet
7
MS4525DO

TE
pressure transducer

 PSI Pressure Ranges
 PCB Mountable
 Digital Output
 Barbed Pressure Ports APPLICATIONS
 Blocked Filter Detection
 Altitude and Airspeed Measurements
 Medical Instruments
 Fire Suppression System
 Panel Meter
 Air Movement/Environmental Con
Datasheet
8
MS4515

TE
pressure transducer

 Inches H2O Pressure Ranges
 PCB Mountable
 High Level Analog Output
 Barbed Pressure Ports APPLICATIONS
 Blocked Filter Detection
 Altitude and Airspeed Measurements
 Medical Instruments
 Fire Suppression System
 Panel Meter
 Air Movement
Datasheet
9
TMS4116

Texas Instruments Inc
16384-Bin Dynamic Random-Access Memory
Datasheet
10
IRLMS4502

International Rectifier
HEXFET Power MOSFET
s Drain Current, VGS @ -4.5V Continuous Drain Current, VGS @ -4.5V Pulsed Drain Current  Power Dissipation Power Dissipation Linear Derating Factor Single Pulse Avalanche Energy„ Gate-to-Source Voltage Junction and Storage Temperature Range Max. -1
Datasheet
11
MS412FE

Seiko
Lithium Rechargeable Battery

• Large discharge capacity : For high operational voltage range of 3.3V to 2.0V.
• Long cycle life : Cycle life of over 100 cycles (over 50 cycles for MS414GE) under charge/discharge conditions of 3.1V to 2.0V (D.O.D.100%).
• Excellent overdischarge
Datasheet
12
AMS4040

Advanced Monolithic Systems
MICROPOWER SHUNT VOLTAGE REFERENCE

• Tight Output Voltage Tolerance
• Low Output Noise
• Operating Current 250µ A to 100mA
• Low Dynamic Impedance
• Low Temperature Coefficient
• Available in the sub-miniature SOT-23 Package
• 1.2V Device ( AMS4041) also available AMS4040 MICROPOWER
Datasheet
13
TMS416409A

National Semiconductor
4194304 BY 4-BIT EXTENDED DATA OUT DYNAMIC RANDOM-ACCESS MEMORIES
maximum RAS access times of 50, 60, and 70 ns. All address and data-in lines are latched on chip to simplify system design. Data out is unlatched to allow greater system flexibility. POWER SUPPLY 5V 5V 3.3 V 3.3 V SELF REFRESH, BATTERY BACKUP
  –
  –
  –
Datasheet
14
TMS426409A

National Semiconductor
4194304 BY 4-BIT EXTENDED DATA OUT DYNAMIC RANDOM-ACCESS MEMORIES
maximum RAS access times of 50, 60, and 70 ns. All address and data-in lines are latched on chip to simplify system design. Data out is unlatched to allow greater system flexibility. POWER SUPPLY 5V 5V 3.3 V 3.3 V SELF REFRESH, BATTERY BACKUP
  –
  –
  –
Datasheet
15
MS4525

TE
pressure transducer

 PSI Pressure Ranges
 PCB Mountable
 High Level Analog Output
 Barbed Pressure Ports APPLICATIONS
 Blocked Filter Detection
 Altitude and Airspeed Measurements
 Medical Instruments
 Fire Suppression System
 Panel Meter
 Air Movement/Enviro
Datasheet
16
MS414GE

Seiko
Lithium Rechargeable Battery

• Large discharge capacity : For high operational voltage range of 3.3V to 2.0V.
• Long cycle life : Cycle life of over 100 cycles (over 50 cycles for MS414GE) under charge/discharge conditions of 3.1V to 2.0V (D.O.D.100%).
• Excellent overdischarge
Datasheet
17
MS40

Diotec Semiconductor
Surface Mount Si-Bridge-Rectifiers
VVRMS [V] 40 80 125 250 380 500 Rep. peak reverse voltage Periodische Spitzensperrspg. VRRM [V] 1) 80 160 250 600 800 1000 f > 15 Hz TA = 25°C TA = 25°C Grenzwerte Marking / Kennzeichnung2) Laser3) B ym C ym E ym J ym K ym M ym IFRM IFSM i2t Tj TS C
Datasheet
18
AMS4154

Advanced Monolithic Systems
2A OUTPUT PWM BUCK CONVERTER

• Stable with low ESR Output Ceramic Capacitors
• Up to 99% On time
• 2A Output Current
• Wide Operating Input Voltage Range 5.5V to 32V
• Fixed 330 kHz Frequency
• Thermal Shutdown
• Cycle-by-cycle Over Current Protection
• Under Voltage Lockout
• 5
Datasheet
19
HYMD212G726AMS4-H

Hynix Semiconductor
Registered DDR SDRAM DIMM







• 1GB (128M x 72) Registered DDR DIMM based on stacked 128Mx4 DDR SDRAM JEDEC Standard 184-pin dual in-line memory module (DIMM) Error Check Correction (ECC) Capability Registered inputs with one-clock delay Phase-lock loop (PLL) clock dr
Datasheet
20
HYMD212G726AMS4M-H

Hynix Semiconductor
Low Profile Registered DDR SDRAM DIMM







• 1GB (128M x 72) Low Profile Registered DDR DIMM based on stacked 128Mx4 DDR SDRAM JEDEC Standard 184-pin dual in-line memory module (DIMM) Error Check Correction (ECC) Capability Registered inputs with one-clock delay Phase-lock loop (P
Datasheet



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