| No. | Partie # | Fabricant | Description | Fiche Technique |
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STATS ChipPAC |
Exposed Pad Quad Flat Pack • Body Sizes: 7 x 7mm to 24 x 24mm • Package Height: 1.0mm (TQFP-ep) and 1.4mm (LQFP-ep) • Lead Counts: 32L to 216L • Lead Pitch: 0.40mm to 0.80mm • Wide range of open tool leadframe and die pad sizes available • JEDEC standard compliant • Lead-free |
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STATS ChipPAC |
Stacked Die Quad Flat Pack • Combining devices into one package reduces PCB real estate and cost • Increased sub-system performance by integrating multiple chips into a single package • Die to die bonding capability for device/signal integration • Standard and green/lead-free |
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