Date : April 10, 2007 Version : 1.4 W83627DHG Data Sheet Revision History PAGES DATES VERSION WEB VERSION MAIN CONTENTS 1 2 N.A. N.A. 12/15/2005 02/22/2006 0.1 0.2 N.A. N.A. 1. 1. 1. 2. 3. 4. 5. 6. 7. 1. 2. 3. 4. First published version. Add descriptions of the registers, functions,, AC/DC timing, and top marking Revise Table 8.1 and the timing ch.
Add descriptions of PECI and SST and a table of SMBus in Chapter 5 Pin Description. Add new sections of Caseopen and Beep Alarm Function in Chapter 7 Hardware Monitor. Add Clock Input Timing, PECI & SST Timing, and SPI Timing in Chapter 21 Specifications. Remove sections 9.4 and 9.5 (EXTFDD and EXT2FDD). Modify the descriptions of Hardware Monitor Device, Bank 0, Index 59h, bits(6..4). Add a beep control bit for VIN4 at Hardware Monitor Device, Bank 0, Index 57h, bit6. Remove status bit of PME# status of MIDI IRQ event at Logical Device A, CRF4, bit 1. Remove control bit of enable/disable PME.
No. | Partie # | Fabricant | Description | Fiche Technique |
---|---|---|---|---|
1 | W83627DHG-P |
nuvoton |
LPC I/O | |
2 | W83627DHG-PT |
nuvoton |
LPC I/O | |
3 | W83627EHF |
Winbond Electronics |
LPC I/O | |
4 | W83627EHF-EF |
Winbond |
LPC I/O | |
5 | W83627EHG |
Winbond Electronics |
LPC I/O | |
6 | W83627EHG-EG |
Winbond |
LPC I/O | |
7 | W83627F |
Winbond |
LPC I/O | |
8 | W83627G |
Winbond |
LPC I/O | |
9 | W83627HF |
Winbond |
Winbond LPC I/O | |
10 | W83627HF-AW |
Winbond |
WINBOND I/O | |
11 | W83627HF-PW |
Winbond |
WINBOND I/O | |
12 | W83627HG |
Winbond |
LPC I/O |