VS-FCSP0530ETR - Vishay

VS-FCSP0530ETR Schottky diode

FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon rather than .

Features

• Ultralow VF to footprint area
• Very low profile (< 0.6 mm)
• Low thermal resistance
• Supplied tested and on tape and reel
• Designed for consumer level APPLICATIONS
• Reverse polarity protection
• Current steering
• Freewheeling
• Flyback
• Oring 0.5 A 30 V 0.33 V 50 μA 15 mA 150 °C 5 mJ DESCRIPTION FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are m.