VN30NSP - STMicroelectronics

VN30NSP HIGH SIDE SMART POWER SOLID STATE RELAY

The VN30NSP is a monolithic devices made using STMicroelectronics VIPower Technology, intended for driving resistive or inductive loads with one side grounded. Built-in thermal shut-down protects the chip from over temperature and short circuit. The input control is 5V logic level compatible. The open drain diagnostic output indicates open circuit (no load) .

Features

urrent Electrostatic Discharge (1.5 k Ω, 100 pF) Power Dissipation at T c ≤ 25 C Junction Operating Temperature Storage Temperature o Valu e 60 45 -45 ± 10 -4 ± 10 2000 108 -40 to 150 -55 to 150 Unit V A A mA V mA V W o o C C CONNECTION DIAGRAMS CURRENT AND VOLTAGE CONVENTIONS 2/8 VN30NSP THERMAL DATA R t hj-ca se R t hj- amb Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max Max 1.15 50 o o C/W C/W ($) When mounted using minimum recommended pad size on FR-4 board ELECTRICAL CHARACTERISTICS (VCC = 13 V; -40 ≤ Tj ≤ 125 oC unless otherwise specified) POWER Symb ol.